NXP and Foxconn Team Up for Connected Car Expansion

Paul Myles

TU-Editor

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21st July 2022

Dutch automotive digital provider, NXP Semiconductors, is teaming up with Taiwan’s Hon Hai (Foxconn) to expand its capabilities in creating mass market connected car platforms.

The pair have signed a memorandum of understanding to jointly develop platforms for a new generation of smart connected vehicles. The collaboration builds on the companies’ initial digital cockpit partnership, based on the NXP i.MX applications processors and NXP Software Defined Radio platform.

The primary focus of the expanded collaboration is aimed at Foxconn’s EV platforms, employing NXP’s system expertise and electrification portfolio, from NXP S32 processors to analog-front-end, drivers, networking and power products. Driverless technology capabilities will be in focus with NXP’s radar solutions together with its hardware and software support.

Kurt Sievers, president and CEO of NXP Semiconductors, said: “We are proud to join forces with Foxconn today to support its ambitious leap into automotive and to jointly address the challenges and opportunities of a new generation of smart connected vehicles, especially Foxconn’s new electric vehicle platform. The auto industry must become faster and more efficient, and NXP is pleased to extend its technology portfolio to enable electrification, next generation architectures, smart and secure car access systems and more.”

— Paul Myles is a seasoned automotive journalist based in Europe. Follow him on Twitter @Paulmyles_